Advanced Vacuum Sputtering Unit for Precision Metal Thin Film Deposition

Our state-of-the-art Vacuum Sputtering Unit represents the pinnacle of thin film deposition technology, engineered for the precise, uniform, and reproducible coating of metal films onto a wide variety of substrates. Utilizing the proven principles of magnetron sputtering, this system is designed to meet the rigorous demands of research, development, and small-scale production in fields such as microelectronics, optics, and materials science.

Magnetron Sputtering Technology

At the heart of our system lies the magnetron sputtering process, a superior Physical Vapor Deposition (PVD) technique. The process occurs within a high-vacuum chamber:

  1. Vacuum Generation: The chamber is evacuated to a high base vacuum to eliminate contaminants, ensuring film purity.

  2. Process Gas Introduction: An inert gas, typically Argon, is introduced at a controlled pressure.

  3. Plasma Ignition: A high voltage is applied to the cathode (the target material), igniting a plasma. Argon ions from the plasma are accelerated towards the target.

  4. Sputtering: The energetic argon ions strike the target, ejecting atoms from its surface through momentum transfer.

  5. Film Deposition: The ejected target atoms travel through the vacuum and condense on the substrate, forming a dense, highly adherent, and uniform thin film.

Main Features

  • Modular Vacuum Chamber: Constructed from high-grade stainless steel, the chamber features multiple ports for versatility. Accessories include quartz viewports, electrical feedthroughs, and gas inlets, allowing for future system expansion.

  • High-Efficiency Magnetron Sputtering Sources: Our water-cooled cathodes are equipped with powerful permanent magnets that confine the plasma, leading to higher deposition rates, lower operating pressures, and reduced substrate heating. They are compatible with a wide range of pure metal targets (e.g., Au, Ag, Al, Cu, Cr, Ti, Pt, Ni).

  • Precision Substrate Holder: The substrate holder is designed for optimal film uniformity. Options include rotation (for enhanced uniformity), heating (to improve film adhesion and crystallinity), and biasing (to control film structure and stress).

  • Advanced Vacuum System: A robust pumping system, comprising a turbo-molecular pump backed by a dry scroll pump, ensures rapid pump-down and achieves an ultra-high vacuum (UHV) base pressure, critical for depositing high-purity films.

  • Intuitive Control System: The unit is managed by a programmable logic controller (PLC) with a user-friendly touch-screen interface. It allows for recipe-based operation, automated process sequences, and real-time monitoring of critical parameters like pressure, power, and deposition time, guaranteeing reproducibility run-after-run.

Applications

Hongfeng VAC's vacuum sputtering unit is ideal for depositing functional and decorative metal films for:

  • Microelectronics & Semiconductors: Fabrication of electrodes, interconnects, and contact layers.

  • Optics & Photonics: Creating reflective coatings, mirrors, and transparent conductive oxides (when using reactive sputtering with oxygen).

  • Materials Research: Developing new coatings for studies in catalysis, corrosion resistance, and surface engineering.

  • Life Sciences: Depositing conductive layers for Scanning Electron Microscopy (SEM) sample preparation.

  • Solar Cells: Manufacturing metallic contacts and back reflectors.

Why Choose Our Sputtering Unit?

  • Superior Film Quality: Produces dense, pinhole-free films with excellent adhesion and uniformity.

  • High Reproducibility: Automated process control ensures consistent results, batch after batch.

  • Operational Flexibility: Modular design allows for easy integration of additional sources (for co-sputtering) or substrate conditioning options.

  • Robust & Reliable: Built with high-quality components for minimal maintenance and maximum uptime.

  • Expert Support: Backed by comprehensive technical support, installation, and training services.

For researchers and engineers who require precision, reliability, and control in their thin film deposition processes, our Vacuum Sputtering Unit is the definitive solution. It is a powerful tool designed to accelerate innovation and ensure the highest quality outcomes.

Contact Hongfeng VAC today to discuss your specific application requirements.