The 99.99% purity titanium target material is a high-performance sputtering target designed specifically for arc ion plating (AIP) applications. Engineered to meet the stringent demands of advanced industries such as semiconductor manufacturing, aerospace, and decorative coatings, this titanium target combines exceptional purity, uniform microstructure, and optimized mechanical properties to ensure superior film quality and process reliability.
Features
- Ultra-High Purity (99.99%)
- The titanium target is refined to 99.99% purity, minimizing impurities such as oxygen, nitrogen, and heavy metals (e.g., Fe, Ni, Cr). This ensures minimal contamination during deposition, critical for applications like semiconductor barrier layers and optical coatings.
- Compliance with ASTM B348 and ISO 9001 standards guarantees consistent quality.
- Fine-Grained Microstructure
- Manufactured via vacuum melting and hot forging, the target exhibits a uniform grain size ≤50 μm with a preferred <002> crystallographic orientation ≥35%. This enhances sputtering efficiency and film adhesion.
- Advanced ultrasonic testing eliminates internal defects like cracks or porosity, ensuring structural integrity.
- Optimized Mechanical Properties
- Density: 4.50–4.51 g/cm³ (close to theoretical density) minimizes porosity-induced arcing during AIP.
- Tensile Strength: 230–460 MPa, enabling resistance to thermal stress during high-power sputtering.
- Melting Point: 1,668°C, ensuring stability under extreme process conditions.
- Customizable Form Factors
- Available in planar (circular/rectangular) and rotary configurations to suit diverse AIP systems.
- Standard dimensions: Diameter 200–460 mm × thickness 10–50 mm; custom sizes up to 4,000 mm in length supported.
- Backing plate options include copper (Cu) or aluminum (Al) alloys, bonded via high-strength diffusion welding or brazing.
Applications
- Semiconductor Industry
- Used as a barrier layer material in integrated circuits (ICs) to prevent copper (Cu) diffusion into silicon (Si), ensuring device reliability at sub-10 nm nodes.
- Deposits titanium nitride (TiN) or titanium aluminum nitride (TiAlN) films for wear-resistant and corrosion-resistant interconnects.
- Aerospace & Defense
- Coats turbine blades and engine components with Ti-based films to enhance oxidation resistance at high temperatures (e.g., NiCoCrAlY coatings).
- Provides lightweight, high-strength coatings for spacecraft structural parts.
- Decorative & Functional Coatings
- Produces iridescent TiN (gold), TiC (black), or TiAlN (rainbow) films for luxury watches, jewelry, and automotive trim.
- Deposits transparent conductive oxide (TCO) films for touchscreens and solar cells.
- Optical & Display Technologies
- Fabricates anti-reflective (AR) coatings for lenses and camera modules.
- Enables low-emissivity (Low-E) glass for energy-efficient buildings.
Choose Our Titanium Target?
- Proven Performance: Validated in high-volume AIP systems for leading semiconductor fabs and aerospace OEMs.
- Reduced Downtime: High material utilization (≥85%) and long service life minimize target changes.
- Sustainability: Recyclable backing plates and eco-friendly manufacturing processes align with green initiatives.