FF-250/2000 High-Speed Turbomolecular Pump | 2000 L/s High Vacuum Solution for Industrial & Research Applications

Achieve ultra-clean, high and ultra-high vacuum (UHV) with the FF-250/2000 Turbomolecular Pump. Engineered for demanding industrial coating, semiconductor manufacturing, and advanced research environments, this pump delivers a massive 2000 L/s pumping speed (N₂) with exceptional reliability. Designed with a ISO-250K flange, it offers seamless integration into large-scale vacuum systems requiring rapid evacuation and stable high vacuum performance.

Features & Benefits

1. Superior Pumping Speed

  • 2000 L/s (N₂): Achieves rapid chamber evacuation, drastically reducing cycle times for sputtering, evaporation, and load-lock applications.

  • High Compression Ratio: >10⁸ for N₂ and >5×10³ for H₂ ensures low ultimate pressure and prevents back-streaming of process gases.

2. Contamination-Free Operation

  • Fully Magnetically Levitated (Maglev) Rotor: Eliminates mechanical wear, oil contamination, and vibration. Perfect for semiconductor fabs and sensitive analytical instruments.

  • Ceramic Bearings: Optional hybrid designs ensure durability during transport or sudden venting.

3. Robust Industrial Design

  • ISO-250K Inlet Flange: Standardized mounting for easy retrofit or new system design.

  • High Gas Throughput: Capable of handling high gas loads common in PVD (Physical Vapor Deposition) and etching processes.

4. Smart Control & Integration

  • Integrated Controller: User-friendly interface with RS-485, Ethernet, and I/O ports for remote monitoring and automation.

  • Soft-Start & Anti-Vibration: Minimizes impact on sensitive processes.

Technical Specifications

Parameter Specification
Model FF-250/2000
Pumping Speed (N₂) 2000 L/s
Ultimate Pressure < 5×10⁻⁸ Pa (with proper backing pump)
Compression Ratio N₂: >10⁸ / H₂: >5×10³
Inlet Flange ISO-250K (Optional: CF-F 250)
Outlet Flange KF-40
Rotation Speed 24,000 – 27,000 rpm (variable)
Start-Up Time < 6 minutes
Cooling Method Air-cooled (standard) / Water-cooled (optional)
Ambient Temperature 5°C – 40°C
Power Supply 100–240 V AC, 50/60 Hz
 
Applications

The FF-250/2000 is the ideal primary high vacuum pump for:

  • Semiconductor Manufacturing: Sputtering, etching, CVD.

  • Thin Film Deposition: Optical coating, decorative coating, metallization.

  • Research & Development: Surface science, particle accelerators, fusion research.

  • Industrial Vacuum Furnaces: Brazing, sintering, heat treatment.

  • Large Chamber Evacuation: Space simulation, vacuum drying.