Vacuum E-beam Evaporation Coating Machine

Main parts of the machine

Electron gun:

 The core component, usually a tungsten filament cathode or hollow cathode, emits hot electrons, which are accelerated by a high-voltage electric field and focused into a high-energy electron beam.

 Equipped with an electromagnetic lens/deflection coil to precisely control the scanning path of the electron beam to avoid local overheating.

Crucible (evaporation source):

 A water-cooled copper crucible is used to prevent high temperature conduction from damaging the equipment. Multiple crucible turntables can be configured to realize alternate deposition of multiple materials.

 Material form: block, granule or powder (such as Au, SiO2, AlO, etc.).

Vacuum pumping system:

 Mechanical pump + molecular pump combination, high vacuum pressure in the vacuum chamber to reduce the influence of gas molecules on the purity of the coating.

Base support:

 With heating function (up to 200 ℃) and rotating mechanism (5-30 rpm) to ensure film thickness uniformity.

 Tilt adjustable to optimize deposition angle.

Thickness monitoring system:

 Quartz crystal oscillator (QCM) or optical monitor for real-time monitoring of deposition rate (0.1-10 nm/s) and thickness (accuracy ± 1%).

Control system:

 PLC controlling system is integrated to automatically adjust parameters such as electron beam power, scanning mode and substrate temperature.

Description:

Electron beam evaporation coating machine (E-Beam Evaporation Coater) is a kind of vacuum coating equipment which uses high-energy electron beam to bombard the evaporated material and make it vaporize and deposit a film on the surface of the substrate.

Electron beam generation and focusing: The electrons emitted by the cathode are accelerated by high voltage and focused by the magnetic field into a high-energy beam with a diameter of 1-5 mm (power density up to 10 10-10 10W/cm ²). Material evaporation: The electron beam bombards the surface of the evaporated material, and the local temperature rises to thousands of degrees Celsius instantaneously, and the material melts and vaporizes. Thin film deposition: Vaporized atoms/molecules move linearly in a vacuum environment and condense on the surface of the substrate to form a film. And that characteristic of the film layer are regulate and controlled by controlling the deposition time, the deposition rate and the substrate temperature.

The system works in batch operations.

Technical features

High purity thin film: Vacuum environment reduces impurity incorporation, combined with ion source assistance (optional) to improve compactness.

Precise controllability: the electron beam scanning mode can avoid crucible contamination, and the film thickness uniformity error is less than ± 2%.

Typical application

 Applicable to: Scientific research and small batch preparation of new thin film materials by universities, research institutes and enterprises.

 Optical film: AR/IR anti-reflection film, reflector (such as MgF Mg, TiO TiO).

 Microelectronics: metal electrode (Al, Cu), dielectric layer (SiOSiO).

 Research field: Superconducting thin film (YBCO), functional oxide deposition.