High‑Precision UHV Magnetron Sputtering PVD Coating System

This ultra‑high‑vacuum magnetron sputtering PVD coating system is a high‑end lab‑grade vacuum deposition equipment, professionally developed for advanced thin‑film research, material science development, and precision component coating. Adopting mature physical vapor deposition technology, it enables high‑uniformity, high‑density thin‑film preparation under ultra‑high‑vacuum environments, widely applied in semiconductors, optoelectronics, new energy materials, hard coatings and other high‑tech fields.

Structure & Key Components

UHV Stainless Steel Vacuum Chamber

Fabricated from high‑quality stainless steel with precise flange sealing design, it achieves excellent air tightness and ultra‑high vacuum level required for thin‑film deposition. The spherical top‑chamber structure optimizes gas flow and film‑forming uniformity.

High‑Efficiency Vacuum Pumping Unit

Equipped with molecular pumps and mechanical pump groups, it rapidly evacuates the chamber to ultra‑high vacuum, effectively removing impurities and ensuring pure thin‑film growth environment.

Precision Sample Transfer & Motion Platform

Custom‑designed multi‑axis precision sample stage supports accurate positioning, rotation and displacement of workpieces. It guarantees consistent coating thickness and outstanding uniformity for small‑batch precision parts.

Complete Sputtering & Auxiliary Systems

Configured with magnetron sputtering cathodes, cooling water circulation system, power supply modules, gas path control units and detection sensors. It stably controls sputtering power, gas flow and working temperature to realize controllable deposition of metal films, alloy films and dielectric films.

Main Features
  • Ultra‑high vacuum design, low‑pollution thin‑film preparation
  • High‑precision motion platform for uniform & repeatable coating
  • Modular structure, flexible for functional expansion and customization
  • Stable power & gas control system for long‑time continuous operation
  • Lab‑grade precision, suitable for R&D and small‑batch high‑end production

Applications:

Semiconductor chips, optical lenses, MEMS devices, conductive thin films, corrosion‑resistant coatings, wear‑resistant hard films, new energy material films, university laboratories, research institutes and high‑tech enterprise R&D centers.
 
Advantages
 
Compared with ordinary industrial coating machines, this system focuses on high precision, high purity and controllable film quality. It meets strict thin‑film research requirements, supports multiple sputtering modes, and provides reliable technical support for advanced material innovation and precision component surface modification.